패널 레벨 포장 형태
(3)
310*320mm 패널 크기 패널 레벨 QFN 낮은 전기 저항
가격: Negotiable
MOQ: Negotiable
배달 시간: Negotiable
Description: 310*320mm panel size, Chip size: 0.76*0.61mm; Package size: 2.76*1.97mm; Package thickness: 360um, Application: Power management, Process introduction: The coming wafer is bumped with Cu post (e.g., 50 micro meters), after thining and dicing of wafer, chips with bump are picked and plac... 더보기
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패널 레벨 포장 칩
(4)
310*320mm 패널 크기 얇은 MOS 칩 실리콘 낮은 전력 소비
가격: Negotiable
MOQ: 3000pcs
배달 시간: 1 month
상표: FZX Fanout Process and Product
Description: Multi-chip MOSFET 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Applications: Military applications, new energy vehicles, Power adapter, power amplifier, automotive electronics, etc. Competitive Advantage: 1... 더보기
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패널 레벨 포장면 아래로-EWLB 높은 열 분산 높은 신뢰성
가격: Negotiable
MOQ: Negotiable
배달 시간: Negotiable
Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipation (thick Cu), high reliability (short connection and strong surface adhesion), high voltage and high current (thick Cu). 2,It can be used in various a... 더보기
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팽창 패널 레벨 패키지
(5)
310*320mm 팬아웃 패널 레벨 패키지 (FOPLP) GaN 제품
가격: Negotiable
MOQ: 3000pcs
배달 시간: 1 month
상표: FZX Fanout Process and Product
310*320mm Panel size; DIE1 size:1.89*1.64mm; DIE2 size:0.926*0.626mm; Package size:6*7mm; Package thickness: 0.42mm; Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the ba... 더보기
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높은 양상 비율 TGV 반도체 포장을 위한 Foundary Capabilities
가격: Negotiable
MOQ: 10 panel
배달 시간: 1 month
상표: FZX -TGV
Description: As shown in the following table, the glass core substrate with 510mmX515mm size can be manufactured inside the manufacturing line. The glass thickness is varied from 0.3mm to 1.5mm (some can be extended to 5mm thick). The aspect ratio (diameter/ thickness of glass)can be varied from 1:1... 더보기
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포장 시뮬레이션 실험
(1)
다양한 포장 시뮬레이션 실험에 적합한 패키지
가격: Negotiable
MOQ: 3000pcs
배달 시간: 1 month
상표: FZX
Description: 1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation. 2. From the electrical simulation of chip to system, SI analysis and PI analysis of package design are realized. 3. Key process feasibility simulation ... 더보기
➤ 방문 웹사이트