팽창 패널 레벨 패키지
(5)310*320mm 팬아웃 패널 레벨 패키지 (FOPLP) GaN 제품
가격: Negotiable
MOQ: 3000pcs
배달 시간: 1 month
상표: FZX Fanout Process and Product
310*320mm Panel size; DIE1 size:1.89*1.64mm; DIE2 size:0.926*0.626mm; Package size:6*7mm; Package thickness: 0.42mm; Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the ba... 더보기
➤ 방문 웹사이트
310*320mm 팬아웃 패널 레벨 패키지 (FOPLP) 라디오 주파수 (RF)
가격: Negotiable
MOQ: 3000pcs
배달 시간: 1 month
상표: FZX Fanout Process and Product
Description: Panel size:310*320mm Package size: 7*6mm Package thickness: 0.75mm Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the back of the plastic sealing material, t... 더보기
➤ 방문 웹사이트
310*320mm 팬 아웃 패널 레벨 패키지 (FOPLP) MEMS 마이크 패키지
가격: Negotiable
MOQ: 3000pcs
배달 시간: 1 month
상표: FZX Fanout Process and Product
Description: Plating uniformity: ≤10%; Package size: 3*2mm; Package thickness: 0.26mm; Chip size: 0.96*0.78mm; Process type: FOPLP (310X320mm); Applications: Mobile phone, Bluetooth headset,MEMS, wearable electronics. Specifications: Package size: 3*2mm; Package thickness: 0.26mm; Chip size: 0.96*0.... 더보기
➤ 방문 웹사이트
310*320mm 팬아웃 패널 레벨 패키지 (FOPLP) CPO/Mini/Micro LED
가격: Negotiable
MOQ: 3000pcs
배달 시간: 1 month
상표: FZX Fanout Process and Product
Description: LED constant current driver chip; Chip size 0.4mm*0.555mm*0.20mm; Panel size 310*320mm; Package size 122mm*50mm; Process: Patch on the temporary carrier board, press EMC film, etching, then drill the hole, do electrode-plating. Applications: Mini-LED, lamps Specifications: Chip size 0.4... 더보기
➤ 방문 웹사이트
310*320mm 팬아웃 패널 레벨 패키지 (FOPLP) 전력 패키지
가격: Negotiable
MOQ: 3000pcs
배달 시간: 1 month
상표: FZX Fanout Process and Product
Description: 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Process flow: face up encapsulation method is adopted. After a single patch, bump, plastic sealing and grinding (exposing the ball), then punch holes and electro... 더보기
➤ 방문 웹사이트