패널 레벨 포장 제품 구조
(4)
패널 레벨 포장면 아래로-EWLB 높은 열 분산 높은 신뢰성
가격: Negotiable
MOQ: Negotiable
배달 시간: Negotiable
Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipation (thick Cu), high reliability (short connection and strong surface adhesion), high voltage and high current (thick Cu). 2,It can be used in various a... 더보기
➤ 방문 웹사이트
팬아웃 패널 레벨 패키지 (FOPLP) - 제품 구조 (face up) - 웨이퍼 펌프
가격: Negotiable
MOQ: 3000pcs
배달 시간: 1 month
상표: FZX Fan-Out Panel Level Packaging
Description: Die with bump of MOS&MOS-Like package can be picked and placed onto the temporary carrier; C mold is performed after above die placement with face-up methodology. The mold grinding, PVD and plating will be made for RDL. The TMV will be made for the top/bot layer connection. The surf... 더보기
➤ 방문 웹사이트
팬아웃 패널 레벨 패키지 (FOPLP) - 제품 구조 ((대면) - 와이어 본드 볼
가격: Negotiable
MOQ: 3000pcs
배달 시간: 1 month
상표: FZX Fanout Process and Product
Description: As shown in above photo, compared with traditional packaging methods, the wire bond ball (copper or gold) can be made from wire bond process, it is similar to bump of chip, therefore, it has higher integration, high reliability, and low cost; through the FOPLP process , multiple MCU and... 더보기
➤ 방문 웹사이트
팬아웃 패널 레벨 패키지 (FOPLP) 제품 구조 임베디드 패키지
가격: Negotiable
MOQ: 3000pcs
배달 시간: 1 month
상표: FZX
Description: 1,Compared with traditional packaging methods, this advanced packaging replaces wire bond and substrate, therefore, it has demonstrated the characteristic of higher integration, high reliability, and low cost ; 2,While maintaining the original foot position design, it is much thinner an... 더보기
➤ 방문 웹사이트