IC 결합 기계
(6)
IC 결합 기계
가격: Negotiable
MOQ: ≥1 pc
배달 시간: 25~50 days
상표: Suneast
하이 라이트:combined selective multi module wave solder, wave soldering multi module combined selective, combined multi module wave solder selective
IC Bonding Machine The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture. IC bonder is suit able for IC... 더보기
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다층 IC 결합 기계 0.25*0.25mm-10*10mm 다이 본더 장비
가격: Negotiable
MOQ: ≥1 pc
배달 시간: 25~50 days
상표: Suneast
하이 라이트:soldering combined multi module wave selective, selective multi module combined wave soldering, combined wave soldering selective multi module
High Precision Multilayer Capability Quick Changeover IC Bonding Machine WBD2200 The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image p... 더보기
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고 정밀 IC 결합 기계 8-12 인치 웨이퍼 다이 결합
가격: Negotiable
MOQ: ≥1 pc
배달 시간: 25~50 days
상표: Suneast
하이 라이트:combined wave soldering multi module selective, magnetic spring motor ce iso, iso ce magnetic spring motor
Automatic Nozzle Change High Precision IC Bonding Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic ... 더보기
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빠른 교환 IC 다이 결합 기계 슈퍼미니 칩 결합 기계
가격: Negotiable
MOQ: ≥1 pc
배달 시간: 25~50 days
상표: Suneast
하이 라이트:wave soldering selective combined multi module, multi module combined wave soldering selective, multi module wave soldering selective combined
Supermini Chip Placement Quick Changeover IC Bonder CBD2200 Special use type high precision IC bonder, for a variety of small batch of placement products. It can automatically switch to a variety of bonding heads, and quickly realize the placement of different parameters of a variety of chips. Featu... 더보기
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고속 소발자국 IC 결합 기계 모듈 플랫폼 Die Bonder 기계
가격: Negotiable
MOQ: ≥1 pc
배달 시간: 25~50 days
상표: Suneast
하이 라이트:spring motor ce iso magnetic, motor iso magnetic spring ce, selective wave solder multi module combined
Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design Features: High speed, accurate solidification capacity ±10um@3σ; High production efficiency, low cost input High multi-chip processing capacity, support 16 different types of chip placement High flexibility to suppor... 더보기
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시너지 펌프 SDB 200
가격: Negotiable
MOQ: ≥1 pc
배달 시간: 25~50 days
상표: Suneast
하이 라이트:selective multi module combined wave solder, wave solder combined selective multi module, selective wave solder combined multi module
Automatic Compact Structure Sintering Die Bonder SDB200 Wafer Loading Introduction: It is designed for power semiconductor IC bonding market, equipped with more powerful BONDHEAD system, which possesses functions like high precision bonding, pressure holding circuit maintaining and heating, achievin... 더보기
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