FCCSP 패키지 기판
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IC 조립에 쓸 녹색 피비쥐에이 / CSP 패키지 기판 0.3 밀리미터 두께 BT 재료
가격: US 85-100 per square meter
MOQ: 1 square meter
배달 시간: 7-10 working days
상표: Horexs
하이 라이트:Green CSP package substrate, BT CSP package substrate, BT PBGA package substrate
PBGA / CSP package substrate production supporting Application:IC assembly,Smart Mobile Devices, Notebook PC, video cameras, PLDs,Microprocessors & controllers, Gate Arrays, Memory, DSPs, PLDs,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electroni... 더보기
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중국을 지원하는 FCCSP 기판 제조
가격: US 120-150 per square meter
MOQ: 1 square meter
배달 시간: 7-10 working days
상표: Horexs
하이 라이트:Gold Plating Soldermask Antenna PCB, 0.1mm Antenna PCB, 0.1mm 4 Layer PCB
Application:Consumer electronics,Internet electronics,telcommunication electronics,Others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.4mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,O... 더보기
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FCCSP 패키지 기판 4L 준비 타입 ENEPIG
가격: US 85-100 per square meter
MOQ: 1 square meter
배달 시간: 7-10 working days
상표: Horexs
하이 라이트:0.2mm Antenna Circuit Board, Intelligent Handwriting Antenna Circuit Board, Large 0.2mm Antenna PCB
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Tacon... 더보기
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semiconductor FCCSP Package Substrate manufacture
가격: US 85-100 per square meter
MOQ: 1 square meter
배달 시간: 7-10 working days
상표: Horexs
Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Necl... 더보기
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0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material
가격: US 85-100 per square meter
MOQ: 1 square meter
배달 시간: 7-10 working days
상표: Horexs
하이 라이트:ENEPIG FCCSP package substrate, Buildup Types FCCSP package substrate, 0.3mm FCCSP substrate
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Tacon... 더보기
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BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
가격: US 85-100 per square meter
MOQ: 1 square meter
배달 시간: 7-10 working days
상표: Horexs
하이 라이트:Green Color FCCSP Package Substrate, Flip Chip FCCSP Package Substrate, BT FCCSP Substrate
FCCSP package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts st... 더보기
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FCCSP 패키지 기판 생산 지지
가격: US 85-100 per square meter
MOQ: 1 square meter
배달 시간: 7-10 working days
상표: Horexs
FCCSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,others; Applicable up to 35µm pitch for flip-chip assembly (peripheral) Thin build-up laminate for SiP applications... 더보기
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플립 침 씨에스피 패키기 기판 생산 지지
가격: US 85-100 per square meter
MOQ: 1 square meter
배달 시간: 7-10 working days
상표: Horexs
Flip Chip CSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,PC/Server : DRAM, SRAM,Smart Mobile Devices ,AP, Baseband, Finger print sensor, etc.Network : Bluetooth, RF... 더보기
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